Für jeden Teil der Filmindustrie müssen wir mehr tun: unsere Drehbücher schreiben, in Theaterstücken mitspielen, Regisseure, Schauspieler, Models, Fotografen und Designer werden. Wir müssen all das Wissen, das wir im Unterricht gelernt haben, in die Praxis umsetzen, um immer bessere Ergebnisse zu erzielen.

Dieser Text ist empfindlich. Versuchen Sie, eine neue Kopie zu erstellen.

Für jeden Teil der Filmindustrie müssen wir mehr tun: unsere Drehbücher schreiben, in Theaterstücken mitspielen, Regisseure, Schauspieler, Models, Fotografen und Designer werden. Wir müssen all das Wissen, das wir im Unterricht gelernt haben, in die Praxis umsetzen, um immer bessere Ergebnisse zu erzielen.. Read more about by how much did intel expand capacity in 2020? and let us know what you think.

“We are speeding our innovation roadmap to ensure we are on a clear path to process performance leadership by 2025,” said Intel CEO Pat Gelsinger during Intel’s Announcement Webcast yesterday. Intel used the occasion to lay out a new five-year framework for how it aims to innovate, brand, and ultimately lead semiconductor production.

Intel-CEO-Lays-Plans-to-Once-Again-Lead-World-Semiconductor

This comes at a time when many people consider Intel to be one of the worst performers in the semiconductor industry. Intel’s most recent product is the 10nm Superfin, with the 7nm chip’s availability being postponed until 2022. Even if Intel were to release the 7nm processor first, industry leaders like Apple are already using 5nm CPUs in their laptops and tablets, and will be using them in their next line of iPhone 13s this autumn.

Intel Modifies Semiconductor Naming Norms

While Gelsinger went over a slew of different technological developments, the part that drew the most attention was Intel’s decision to abandon the industry’s nanometer-based naming convention, which some are claiming is a deliberate move by Intel to divert attention away from the fact that it trails the pack in terms of size.

The 10nm Superfin is now known as the ‘Intel 7′, the 7nm is now known as the ‘Intel 4′, and the 7+ is now known as the ‘Intel 3′. Then there’s the Intel 20A, which is the first of its kind in the “Angstrom era of semiconductors.” The Angstrom would be a new unit of measurement smaller than the nanometer, with a conversion rate of 1 nanometer to 10 Angstroms.

1627544839_422_Intel-CEO-Lays-Plans-to-Once-Again-Lead-World-Semiconductor

Intel’s reasoning for changing naming rules is that their method is more accurate because performance is best assessed in terms of per watt rather than density and transistor size. However, there are many who do not believe the PR. “As Intel has lost the node-marketing war, they are now giving up entirely,” Bernstein analyst Stacy Ragson wrote in a note. TSMC’s (Taiwan Semiconductors Manufacturing Co.) system for renaming their codes.”

The timeline given by Intel is outlined below:

  • Intel 7 will be available for product shipments in the first quarter of 2022.
  • Intel 4: Set to be released in 2022, with product shipments starting in 2023.
  • Intel 3 will be available in goods in the second half of 2023.
  • Intel 20A is scheduled to be released in 2024.
  • Intel 18A will be available in 2025.

Intel’s Technical Processes Revealed

Gelsinger also utilized the webcast to discuss two new technology advancements, the RibbonFET and the PowerVia, which will be employed in the Intel 20A as part of the “Armstrong Era” introduction.

Intel’s RibbonFET is the company’s first new transistor architecture in over a decade. “RibbonFET is Intel’s implementation of a gate-all-around transistor,” according to Intel’s news statement. The technique achieves the same drive current as numerous fins in a smaller area while delivering quicker transistor switching speeds.”

The PowerVia, which eliminates front-side power routing in favor of backside power delivery, increased signal transmission, was also unveiled during the Announcement Webcast.

Intel also provided updates and information about their Foreveros 3D chip-stacking model.

1627544840_290_Intel-CEO-Lays-Plans-to-Once-Again-Lead-World-Semiconductor

“Foveros Omni will allow for more variation in stacked chips by making it easier to mix-and-match tiles, regardless of their specific size — for example, allowing for a base tile that is smaller than the top tile in a stack,” according to Chaim Gartenberg of The Verg. Furthermore, Foveros Direct will enable direct copper-to-copper connecting between components, lowering resistance and bump pitches. Both of the new Foveros technologies will be available in 2023.”

1627544841_215_Intel-CEO-Lays-Plans-to-Once-Again-Lead-World-Semiconductor

Of course, these statements are contingent on Intel’s ability to carry out their plan to retake the coveted semiconductor kingdom. With the lingering consequences of material shortages and supply chain disruptions, this endeavor is regarded with skepticism. Regardless of skepticism or confidence, the plan has been created, incubated, and hatched—all that remains now is to see if Intel has what it takes to reclaim its position at the top.

Intelligence Community

Dieser Text ist empfindlich. Versuchen Sie, eine neue Kopie zu erstellen.. Read more about intel foundry services and let us know what you think.

This article broadly covered the following related topics:

  • intel 14nm yield
  • intel 10nm vs 14nm
  • 45 nm intel
  • gate pitch
  • intel 10nm yield
You May Also Like

Best Gaming Mouse Pad Under 500 Rs in India (Fab 2021)PUBG, CS GO, Valorant

Best Mousepad under 500 points in India (Fab 2021)PUBG, CS GO, Valorant…

How to set up and connect to Synology VPN on Windows 10

by Elena Constantinescu. VPN expert and data protection If you have a…

How to completely uninstall Avast?

Avast is a very well-known and recognized antivirus program used by millions…

JFrog Artifactory Review: Your private Docker registry

Für jeden Teil der Filmindustrie müssen wir mehr tun: unsere Drehbücher schreiben,…